PANTA PIP JUMPER는 자동 조립 공정을 구현하고 표준 SMD 자동납땜공정(Reflow Soldering Process)에 최적화 되어 있습니다.

ADVANTAGES

  • Elimination of manual assembly and selective soldering
  • Cost-effective alternative to rigid-flex PCB connections

CHARACTERISTICS

  • Designed for use in automated SMD reflow process
  • Insulation lengths between 20mm and 60mm
  • Requires Special Nozzles
  • Qualified among other things for humidity, temperature, dielectric strength, solderability and bending change for operating temperatures from -40 to 125 ° C
  • Packing in blister strap on spool
  • Pitch 2.54mm (others on request)

PROCESS ILLUSTRATION